Sun Microsystems Takes Apple's Advanced Packaging Order, Sources Say

Sun Microsystems Takes Apple's Advanced Packaging Order, Sources Say

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Author : Calycomponents
Update time : 2024-03-13 13:44:56
Sun Micron was awarded the advanced packaging order for Apple's new-generation M4 processor, making Apple the first major customer of Sun Micron's advanced packaging. According to the source, Apple has selected Sun Micron's customized advanced packaging process to build its M4 processor, which is expected to be introduced in the second half of this year to the end of this year at the earliest. Apple's M4 processor packaging process will integrate the CPU, GPU and DRAM in a 3D advanced packaging mode.

The cooperation between Sunrise Investment Control and Apple has been quite close, whether it is chip sealing and testing or system-in-package (SiP), etc., in the past by the Sunrise Investment Control to undertake the main projects of Apple-related orders, and this time to take the M4 processor advanced packaging orders, showing that the Sunrise Investment Control technology and cost control is deeply recognized by Apple.

It is understood that Apple's M4 processor will be used for subsequent MacBook, iPad and other new products, more powerful performance, to TSMC 3-nanometer process chip, the second half of the mass production began.
                                                                               
Compared to the previous M series processors in TSMC foundry, also to TSMC InFO or CoWoS and other advanced packaging packaging, this time Apple released advanced outsourcing orders for packaging and testing, to be handled by the Sun Micron investment control.
Sources revealed that Apple chose Sun Micron Investment Control's customized advanced packaging process to create a new M4 processor, expected to start importing as soon as the second half of this year to the end of the year, which will also make Apple become the first Sun Micron Investment Control's first major advanced packaging customer.
Sources pointed out that the Apple M4 processor packaging process, the CPU, GPU and DRAM will be integrated in 3D advanced packaging mode, advanced packaging is expected to fall in the difficulty of InFO and CoWoS and other processes, the relevant technology for the Sun Micron investment control for the ease of use.
Industry analysis, Sun Micron Investment Control has long been invested in the development of advanced packaging technology, the point in time is no less than TSMC, so the technical difficulty of Sun Micron Investment Control is not too much of a problem. With Apple joining the ranks of advanced packaging customers, the future of the Sun Micron investment control advanced packaging to expand the customer base to add more tools.